Component Obsolescence: NXP MCU, RF Power, Alliance Memory, Bourns/Riedon, and Amphenol EOL Updates
Several important electronic component families are moving through active End-of-Life (EOL) and discontinuation programs in 2026, creating immediate planning requirements for procurement and engineering teams.
NXP's Chandler fab and probe closure affects legacy MCU and processor families including MC908, MC9S08, MCF51, SPC561, SPC562, and related S08 automotive devices. The last-time-buy deadline is August 6, 2027, and final deliveries are scheduled for August 6, 2028.
NXP's RF Power discontinuation affects products across the A2I, A3T, AFIC, AFM, and MRF families. The last-time-buy deadline is September 30, 2026, followed by final deliveries on September 30, 2027.
Alliance Memory's AS25F3xx Serial NOR EOL affects three industrial 3V flash devices, with a last-time-buy deadline of August 31, 2026, and final shipments scheduled for February 28, 2027.
Bourns/Riedon resistor discontinuations affect selected metal-foil, metal-oxide, network, thick-film power, and high-power wirewound products. The last-time-buy period has passed, with final shipments scheduled for August 31, 2026.
Amphenol ACS HPL-578 BERGSTIK headers have a last-time-buy deadline of September 15, 2026, with no listed alternatives for the four affected part numbers.
Many affected devices are sole-source, have limited availability, or have no manufacturer-listed direct replacement, making early BOM reviews, lifetime-buy calculations, alternate qualification, redesign planning, and obsolete-component sourcing increasingly important. Last-time buys can also create excess inventory if demand changes.
Microchip USA supports both sides of the EOL process through obsolete and hard-to-find component sourcing, lifecycle support, and Excess Inventory Management services.
Obsolescence Risks Require Early Action
Electronic component obsolescence requires action before manufacturer deadlines because availability can tighten well before the official last-time-buy date. In 2026, active discontinuations from NXP, Alliance Memory, Bourns/Riedon, and Amphenol are affecting microcontrollers, RF power devices, Serial NOR Flash, resistors, and connectors used across long-life industrial, automotive, communications, aerospace, and other electronic systems.
NXP's Chandler fab and probe closure covers a broad population of limited-availability and sole-source devices, while its separate RF Power discontinuation places a September 30, 2026 last-time-buy deadline on additional legacy components. Alliance Memory has an August 31, 2026 deadline for select AS25F3xx industrial Serial NOR Flash devices, while Amphenol ACS has a September 15 deadline for several BERGSTIK headers.
These notices demonstrate why lifecycle management should extend beyond tracking an EOL date. Procurement and engineering teams should review affected bills of materials (BOMs), estimate remaining lifetime demand, evaluate alternate components, determine whether redesigns are required, establish sourcing options for future obsolete requirements, and plan for excess inventory that could remain after a lifetime buy.
A successful EOL strategy protects production while controlling inventory exposure and creating a long-term plan for both component availability and unused stock.
NXP MCU Discontinuations: What the Chandler Fab Closure Means for Legacy Designs
NXP's Chandler fab and probe closure is discontinuing a broad range of legacy MCUs and processors, including devices from the MC908, MC9S08, MCF51, SPC561, SPC562, and related S08 families. NXP discontinuation notice 202608007DN identifies many affected products as limited-availability or sole-source devices, increasing the importance of early lifecycle planning.
NXP Chandler Fab and Probe Closure
The Chandler closure represents a full withdrawal for many affected NXP products rather than a routine transition to a direct replacement. The discontinuation population includes legacy microcontrollers and processors that may remain embedded in established designs even though newer semiconductor platforms are available. For organizations supporting long product lifecycles, that distinction matters. A component used in an industrial control platform, vehicle subsystem, communications product, aerospace application, or other long-running design may need to remain available for years after the original production design was completed.
NXP lists August 6, 2027, as the last-time-buy deadline and August 6, 2028, as the last delivery date for the affected Chandler products. However, the notice also identifies affected devices as having limited availability, meaning organizations should not assume every part will remain readily available until the formal deadline.
Affected NXP MCU and Processor Families
The Chandler discontinuation affects several established NXP MCU and processor families that may still be present in active and legacy BOMs, including MC908, MC9S08, MCF51, SPC561, SPC562, and related S08 automotive devices. The discontinuation includes specific products such as MC908AP, MC9S08AC/GT/JM, MCF51AC/AG, and SPC561/SPC562 devices.
Organizations using these families should identify exact manufacturer part numbers rather than assuming an entire family has the same lifecycle status. Package, temperature grade, qualification level, and individual orderable part number can all affect sourcing and replacement decisions.
Managing Risk in Legacy NXP Designs
Legacy designs that use discontinued NXP components should be reviewed early to assess sourcing and redesign risks. Teams should identify affected parts, compare inventory with remaining demand, and determine whether qualified alternatives exist.
If no direct replacement is available, companies may need to secure additional inventory, begin redesign work, or use independent sourcing to support production after authorized supply ends.
NXP RF Power Product Discontinuations: Preparing for the 2026 Last-Time-Buy Deadline
NXP's legacy RF Power discontinuation requires more immediate action because affected A2I, A3T, AFIC, AFM, and MRF products reach their last-time-buy deadline on September 30, 2026. NXP final notice 202603037DN covers limited-availability and sole-source RF power products, with direct replacements generally not listed.
NXP Withdraws Legacy RF Power Products
NXP is fully withdrawing selected legacy Radio Power components rather than broadly transitioning them to direct manufacturer replacements. Affected products include A2I09VD030GNR1, A3T09S100NR1, AFIC10275GNR1 and MRF300AN. The notice also includes additional devices across the A2I, A3T, AFIC, AFM, and MRF portfolios.
Critical Upcoming Lifecycle Dates
September 30, 2026, is the final manufacturer order date identified for the affected NXP Radio Power products, and the last delivery is September 30, 2027. The one-year period between final ordering and final delivery does not eliminate the need for early planning. Procurement teams still need to determine required quantities before the September 2026 ordering deadline.
Managing NXP RF Power EOL Risk
With few direct replacements listed, the priority is to secure supply while there is still time to evaluate alternatives. Before the September 30, 2026, last-time-buy deadline, buyers should confirm remaining production needs, review available inventory, and determine whether additional quantities are required.
Potential substitutes must be checked for RF performance, power handling, thermal characteristics, packaging, and board compatibility. Programs that cannot transition in time should also plan for post-EOL sourcing.
Alliance Memory Serial NOR EOL: What Buyers Need to Know Before August 31, 2026
Alliance Memory is discontinuing three AS25F3xx industrial 3V Serial NOR Flash devices with a last-time-buy deadline of August 31, 2026. The affected products include 4Mb, 16Mb, and 64Mb devices, and two of the three have no listed alternative.
Alliance Memory Discontinues Select AS25F3xx Serial NOR Flash
Alliance Memory PDN 290520262 places three AS25F3xx devices into an active EOL process with a near-term August 31, 2026 last-time-buy deadline. The affected products are 4Mb (AS25F304MD-10S1IN/TR), 16Mb (AS25F316MQ-10S1IN/TR) and 64Mb WSON (AS25F364MQ-10WIN/TR).
Because Serial NOR Flash can store firmware, configuration data, boot code, and other application-specific information, replacing one device with another can require more than a capacity comparison.
Alliance Memory EOL Deadlines
The final ordering date for the affected Alliance Memory AS25F3xx products is August 31, 2026, with final shipments scheduled for February 28, 2027.
Organizations that identify one of these devices in an active BOM should evaluate their requirements immediately.
Replacement Limitations
Alliance Memory lists no alternative for the affected 4Mb and 16Mb devices, while the discontinued 64Mb product points to a 128Mb device for evaluation. The 128Mb option should not automatically be treated as a drop-in replacement simply because it is identified for evaluation. Engineers should verify the package, voltage, command compatibility, memory architecture, firmware dependencies, temperature requirements, and other application-specific requirements before qualification.
What Buyers Should Review Immediately
Buyers using an affected AS25F3xx device should determine lifetime demand and replacement feasibility before the August 31 deadline. For the 4Mb and 16Mb products, the absence of a listed alternative makes early sourcing and engineering planning particularly important.
Other 2026 EOL and Last-Time-Buy Alerts
Bourns/Riedon and Amphenol ACS have additional 2026 discontinuation deadlines affecting resistors and connectors, showing that current obsolescence risk extends beyond semiconductors and memory. The Bourns/Riedon last-time-buy window has already closed, while Amphenol's affected BERGSTIK headers have a September 15, 2026, last-time-buy deadline.
Bourns / Riedon Resistor Discontinuations
The last-time-buy period has already passed for selected Bourns/Riedon power, foil, network, and wirewound resistors, with final shipments scheduled for August 31, 2026.
Notices N2541REV and N2552REV discontinue selected metal-foil resistors, metal-oxide resistors, resistor networks, thick-film power resistors and high-power wirewound resistors. N2541REV lists no replacements for the affected products. N2552REV identifies PWR221T and PWR220T as potential alternatives for selected NHR, NPR, and PF2202 parts.
Because the last-time-buy window has already passed, organizations still using these components should review their inventory immediately. Remaining production and service requirements should be compared with on-hand stock, and suggested alternatives evaluated where applicable. For components without replacements (or when current inventory cannot meet lifetime demand), sourcing obsolete and hard-to-find components may be required to maintain existing designs.
Amphenol ACS HPL-578 BERGSTIK Header Discontinuation
Amphenol ACS is discontinuing four HPL-578 BERGSTIK header part numbers with a last-time-buy deadline of September 15, 2026, and no listed alternatives.
Affected products include 10081811-101-07LF, 10111608-101-07LF, 10111608-102-07LF and 77316-162LF. Amphenol PCN-26 027 attributes the discontinuation to low demand and portfolio pruning. Because no alternative is listed, buyers should identify affected BOMs, calculate remaining production and service requirements, and begin evaluating alternate connector options before the September deadline.
Managing Last-Time Buys and Excess Inventory
Effective last-time-buy planning must protect future production without creating unnecessary surplus inventory that ties up capital after demand changes. An EOL notice often requires procurement teams to purchase inventory months or years before every unit will be consumed. Forecast uncertainty makes that calculation difficult, especially for long-life programs.
When Last-Time Buys Become Excess Inventory
Even a carefully calculated lifetime buy can become excess inventory when actual demand differs from the original forecast.
Surplus inventory can result when production volumes decline, programs are canceled, a redesign is completed earlier than expected, client requirements change, or a qualified alternate becomes available. Unused electronic components then remain as assets on the balance sheet while also occupying warehouse space and incurring carrying costs. EOL inventory can become especially difficult to manage internally because the original organization may no longer have a production use for it even though demand still exists elsewhere in the market.
Microchip USA Excess Inventory Management
Microchip USA's Excess Inventory Management services help clients recover value from surplus electronic components and improve inventory efficiency after demand, designs, or lifecycle requirements change.
EOL transitions are among several situations that can generate excess stock, particularly when organizations intentionally purchase additional components to ensure long-term production.
Electronic Component Asset Recovery
Microchip USA evaluates excess inventory against current component demand, lifecycle status, availability, market conditions, and potential resale opportunities.
A legacy or discontinued component that has no value to one production program may still be critical to another organization maintaining an older design. This creates an opportunity to connect unused inventory with active market demand.
Our excess inventory programs can support active components, legacy inventory, End-of-Life devices, obsolete parts, hard-to-find components, memory, passives, connectors, semiconductors, and electromechanical products.
Connecting Excess Inventory With Market Demand
Microchip USA uses its global sourcing network and industry relationships to increase market visibility for excess electronic components.
The objective is to identify potential demand for inventory that would otherwise remain unused. Depending on the inventory profile and market conditions, this can help clients recover capital, reduce stock, and improve warehouse efficiency while making components available to organizations that still require them.
Build a Complete EOL and Obsolescence Strategy
A complete EOL strategy combines lifecycle monitoring, last-time-buy planning, alternate qualification, sourcing obsolete components, and excess inventory recovery.
Structured EOL and Obsolescence Approach
Monitor BOMs for lifecycle risk. Identify critical components before an EOL notice creates an immediate sourcing issue.
Track PCN, PDN, and EOL announcements. Record manufacturer deadlines and changes that affect existing designs.
Forecast lifetime requirements. Calculate production, service, repair, and safety-stock needs.
Secure last-time-buy inventory when necessary. Purchase enough supply to protect operations without automatically maximizing stock.
Evaluate alternatives and redesign options. Start engineering work while original components remain available.
Source obsolete and hard-to-find components when required. Create a plan for programs that continue beyond authorized availability.
Recover value from excess inventory. Reassess surplus stock when forecasts, designs, or production requirements change.
This approach treats obsolescence as an ongoing supply-chain process rather than a one-time purchasing event.
Microchip USA Supports Obsolescence and EOL Challenges
Microchip USA helps clients manage the full EOL lifecycle by sourcing obsolete and hard-to-find components, supporting supply-chain planning, and recovering value from excess inventory.
Our sourcing capabilities can help clients maintain production when original manufacturer availability declines, while our Excess Inventory Management services address the opposite challenge: components purchased for long-term requirements that are no longer needed. Managing both sides of the lifecycle can help organizations protect production, reduce unnecessary exposure to inventory, and recover working capital from surplus stock.
Plan for EOL Before It Becomes a Production Problem
Facing an upcoming EOL deadline, searching for a discontinued component, or managing excess inventory from a last-time buy? Microchip USA can help identify sourcing options, reduce lifecycle risk, and recover value from surplus electronic components. Request a quote below or contact our team to discuss sourcing and excess inventory options.